TINETAR@
Warpage and Thickness Measurement Tools for Panel Plate, Metal Carrier and Wafer
Warpage Measurement
Designed to measure warpage and thickness of metal- carrier (620x620mm) and panel (600x600mm).
Warpage – To measure whether the panel surface is convex or concave by using Laser Technology and can result the review of 2D, 3D Shape.
- Reference Distance: 200mm
- Measurement Range ±48 mm(F.S.=96 mm)
- Repeatability: 1µm
- Precision: 0.096mm
- Accuracy: 0.096mm
- Linearity: ±0.1% of F.S.(0.096mm)
- Measurable Material: Glass, metal Carrier, molded panel with EMC and aluminum
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Thickness Measurement
Thickness – To measure the thickness of panel by using dual head sensor.
- Measurement Range: Between 70mm from bottom sensor head and 30mm from top sensor head, ±3.5 (mm)
- Repeatability: 5µm
- Precision: ± 4.4 µm
- Accuracy: ± 4.4 µm
- Linearity: ±2.2 μm
- Measurable: Minimum 100 points
